ΠΡΠΈΡΠΊΠΎ Π·Π° ΡΠ°Π·ΠΈ Π΅Π»Π΅ΠΊΡΡΠΎΠ½Π½Π° ΠΊΠ½ΠΈΠ³Π°
As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an...
ΠΡΠΊΡΠΈΠΉΡΠ΅ ΠΎΡΠ΅
ΠΡΠ΅Π½Π΅ΡΠ΅ ΡΠ°Π·ΠΈ Π΅Π»Π΅ΠΊΡΡΠΎΠ½Π½Π° ΠΊΠ½ΠΈΠ³Π°
ΠΠ°ΠΆΠ΅ΡΠ΅ Π½ΠΈ ΠΊΠ°ΠΊΠ²ΠΎ ΠΌΠΈΡΠ»ΠΈΡΠ΅.
ΠΠ½ΡΠΎΡΠΌΠ°ΡΠΈΡ Π·Π° ΡΠ΅ΡΠ΅Π½Π΅ΡΠΎ
Π‘ΠΌΠ°ΡΡΡΠΎΠ½ΠΈ ΠΈ ΡΠ°Π±Π»Π΅ΡΠΈ
ΠΠ½ΡΡΠ°Π»ΠΈΡΠ°ΠΉΡΠ΅ ΠΏΡΠΈΠ»ΠΎΠΆΠ΅Π½ΠΈΠ΅ΡΠΎ Google Play ΠΠ½ΠΈΠ³ΠΈ Π·Π° Android ΠΈ iPad/iPhone. Π’ΠΎ Π°Π²ΡΠΎΠΌΠ°ΡΠΈΡΠ½ΠΎ ΡΠ΅ ΡΠΈΠ½Ρ
ΡΠΎΠ½ΠΈΠ·ΠΈΡΠ° Ρ ΠΏΡΠΎΡΠΈΠ»Π° Π²ΠΈ ΠΈ Π²ΠΈ ΠΏΠΎΠ·Π²ΠΎΠ»ΡΠ²Π° Π΄Π° ΡΠ΅ΡΠ΅ΡΠ΅ ΠΎΠ½Π»Π°ΠΉΠ½ ΠΈΠ»ΠΈ ΠΎΡΠ»Π°ΠΉΠ½, ΠΊΡΠ΄Π΅ΡΠΎ ΠΈ Π΄Π° ΡΡΠ΅.
ΠΠ°ΠΏΡΠΎΠΏΠΈ ΠΈ ΠΊΠΎΠΌΠΏΡΡΡΠΈ
ΠΠΎΠΆΠ΅ΡΠ΅ Π΄Π° ΡΠ»ΡΡΠ°ΡΠ΅ Π·Π°ΠΊΡΠΏΠ΅Π½ΠΈΡΠ΅ ΠΎΡ Google Play Π°ΡΠ΄ΠΈΠΎΠΊΠ½ΠΈΠ³ΠΈ ΠΏΠΎΡΡΠ΅Π΄ΡΡΠ²ΠΎΠΌ ΡΠ΅Π± Π±ΡΠ°ΡΠ·ΡΡΠ° Π½Π° ΠΊΠΎΠΌΠΏΡΡΡΡΠ° ΡΠΈ.
ΠΠ»Π΅ΠΊΡΡΠΎΠ½Π½ΠΈ ΡΠ΅ΡΡΠΈ ΠΈ Π΄ΡΡΠ³ΠΈ ΡΡΡΡΠΎΠΉΡΡΠ²Π°
ΠΠ° Π΄Π° ΡΠ΅ΡΠ΅ΡΠ΅ Π½Π° ΡΡΡΡΠΎΠΉΡΡΠ²Π° Ρ Π΅Π»Π΅ΠΊΡΡΠΎΠ½Π½ΠΎ ΠΌΠ°ΡΡΠΈΠ»ΠΎ, ΠΊΠ°ΡΠΎ Π½Π°ΠΏΡΠΈΠΌΠ΅Ρ Π΅Π»Π΅ΠΊΡΡΠΎΠ½Π½ΠΈΡΠ΅ ΡΠ΅ΡΡΠΈ ΠΎΡ Kobo, ΡΡΡΠ±Π²Π° Π΄Π° ΠΈΠ·ΡΠ΅Π³Π»ΠΈΡΠ΅ ΡΠ°ΠΉΠ» ΠΈ Π΄Π° Π³ΠΎ ΠΏΡΠ΅Ρ
Π²ΡΡΠ»ΠΈΡΠ΅ Π½Π° ΡΡΡΡΠΎΠΉΡΡΠ²ΠΎΡΠΎ ΡΠΈ. ΠΠ·ΠΏΡΠ»Π½Π΅ΡΠ΅ ΠΏΠΎΠ΄ΡΠΎΠ±Π½ΠΈΡΠ΅ ΠΈΠ½ΡΡΡΡΠΊΡΠΈΠΈ Π² ΠΠΎΠΌΠΎΡΠ½ΠΈΡ ΡΠ΅Π½ΡΡΡ, Π·Π° Π΄Π° ΠΏΡΠ΅Ρ
Π²ΡΡΠ»ΠΈΡΠ΅ ΡΠ°ΠΉΠ»ΠΎΠ²Π΅ΡΠ΅ Π² ΠΏΠΎΠ΄Π΄ΡΡΠΆΠ°Π½ΠΈΡΠ΅ Π΅Π»Π΅ΠΊΡΡΠΎΠ½Π½ΠΈ ΡΠ΅ΡΡΠΈ.
